February 03, 2003
Samsung Electronics announced the industry’s first System-in-Package (SiP) with an ARM®-based processor, NAND flash and SDRAM for next-generation mobile phone and handheld applications. The new SiP solution integrates advanced logic and memory technology into a single package, reducing component count and shrinking form factors for handheld devices.
February 03, 2003
QLogic Corp. announced that QLogic technology is being used in HP's highly integrated Fibre architecture, helping enable robust heterogeneous storage area network (SAN) support on HP ProLiant BL p-Class blade servers. The advanced architecture features "Fibre Down," the integration of single-chip Fibre Channel host bus adapters onto blade servers.
February 03, 2003
Samsung Electronics announced the industry’s first System-in-Package (SiP) with an ARM®-based processor, NAND flash and SDRAM for next-generation mobile phone and handheld applications. The new SiP solution integrates advanced logic and memory technology into a single package, reducing component count and shrinking form factors for handheld devices.
February 03, 2003
QLogic Corp. announced that QLogic technology is being used in HP's highly integrated Fibre architecture, helping enable robust heterogeneous storage area network (SAN) support on HP ProLiant BL p-Class blade servers. The advanced architecture features "Fibre Down," the integration of single-chip Fibre Channel host bus adapters onto blade servers.