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News Archive

February 18, 2003

Intel To Convert Arizona Factory To 300 MM Technology

Intel Corporation disclosed plans to convert Fab 12, a 200-mm wafer fabrication facility located in Chandler, Ariz. to a 300-mm wafer fab. The conversion project will begin in the first half of 2004 with production scheduled to begin in late 2005. The converted fab will start up production on 65-nanometer process technology.

February 17, 2003

Samsung and Infineon Demonstrate Smart Phone System Solutions

Samsung Electronics and Infineon Technologies announced a co-operation to provide a comprehensive smartphone system solution, based on Symbian OS, that will significantly reduce development time.

February 17, 2003

Microsoft and Intel Unveil Windows Powered Smartphone Concept Design Based on Intel Personal Interne

At 3GSM World Congress 2003, Microsoft Corp. and Intel announced the immediate availability of the first Microsoft and Intel Windows® Powered Smartphone concept design based on the Intel® Personal Internet Client Architecture (Intel PCA). The joint hardware-software concept design allows manufacturers to expedite development and reduce the cost of bringing advanced, data-enabled handsets to market.

February 14, 2003

Adaptec Products Support Final iSCSI Standard Ratified by IETF

Adaptec, Inc. announced full product support for the iSCSI standard ratified this week by the Internet Engineering Task Force (IETF). Adaptec's complete line of iSCSI ASICs and host bus adapters, available later this quarter, fully support the IETF standard.

February 14, 2003

New Canyon mainboards II

Canyon to present new Socket 478 mainboard - i845D based CN-9IDM, VIA P4X266E/VT8235 based CN-9V2A, and VIA P4M266A/VT8235 based CN-9V2M-L with integrated LAN controller.

February 14, 2003

New Canyon mainboards II

Canyon to present new Socket 478 mainboard - i845D based CN-9IDM, VIA P4X266E/VT8235 based CN-9V2A, and VIA P4M266A/VT8235 based CN-9V2M-L with integrated LAN controller.

February 13, 2003

Intel Announces 'Wireless-Internet-On-A-Chip' For Cell Phones

Intel Corporation announced a new cellular processor that uses advanced "wireless-Internet-on-a-chip" technology.

February 13, 2003

Intel Announces 'Wireless-Internet-On-A-Chip' For Cell Phones

Intel Corporation announced a new cellular processor that uses advanced "wireless-Internet-on-a-chip" technology.

February 11, 2003

Promise Technology Boosts Performance of Four-Drive Ultra ATA/133 RAID Systems with New FastTrak TX4

Promise Technology, Inc.announced expansion of its FastTrak family of ATA RAID controllers with the FastTrak TX4000 controller for Ultra ATA/133 drives.

February 11, 2003

Promise Technology Boosts Performance of Four-Drive Ultra ATA/133 RAID Systems with New FastTrak TX4

Promise Technology, Inc.announced expansion of its FastTrak family of ATA RAID controllers with the FastTrak TX4000 controller for Ultra ATA/133 drives.

February 10, 2003

TapeWare ahead of the curve with Hewlett Packard tape drives

Yosemite Technologies to announce the release of Version 6.3, Service Pack 3C of TapeWare their flagship backup software product. With this release TapeWare has now certified and supports all StorageWorks tape drives.

February 10, 2003

XIOtech Corporation Certified With Agfa IMPAX For Fast and Reliable Access to PACS Records

Agfa HealthCare has certified XIOtech Corporation’s MAGNITUDE™ storage platform for use with its IMPAX® PACS platform. Networked storage pioneer XIOtech is the only storage vendor to deliver storage solutions created for the healthcare industry. These solutions complement the healthcare industry’s trend away from server-attached storage and slow mechanical archive jukeboxes.

February 10, 2003

New Canyon mainboards

Canyon announced new Socket 478 mainboards - CN-9IPEA, CN-9IGEM, CN-9IGEA, and Socket A CN-7V4A with powerful features for high-performance systems.

February 10, 2003

XIOtech Corporation Certified With Agfa IMPAX For Fast and Reliable Access to PACS Records

February 10, 2003

New Canyon mainboards

Canyon announced new Socket 478 mainboards - CN-9IPEA, CN-9IGEM, CN-9IGEA, and Socket A CN-7V4A with powerful features for high-performance systems.

February 03, 2003

Samsung Develops Industry’s First SiP Stacking Processor With NAND Flash and SDRAM

Samsung Electronics announced the industry’s first System-in-Package (SiP) with an ARM®-based processor, NAND flash and SDRAM for next-generation mobile phone and handheld applications. The new SiP solution integrates advanced logic and memory technology into a single package, reducing component count and shrinking form factors for handheld devices.

February 03, 2003

QLogic "Fibre Down™" Integrated in HP ProLiant Blade Servers for Connectivity to Storage Area Networ

QLogic Corp. announced that QLogic technology is being used in HP's highly integrated Fibre architecture, helping enable robust heterogeneous storage area network (SAN) support on HP ProLiant BL p-Class blade servers. The advanced architecture features "Fibre Down," the integration of single-chip Fibre Channel host bus adapters onto blade servers.

February 03, 2003

Samsung Develops Industry’s First SiP Stacking Processor With NAND Flash and SDRAM

February 03, 2003

QLogic "Fibre Down™" Integrated in HP ProLiant Blade Servers for Connectivity to Storage Area Networ

January 29, 2003

Samsung Develops Industry’s Fastest DDR3 SRAM for High Performance EDP and Network Applications

Samsung Electronics Co., Ltd. announced the development of the world’s fastest DDR3 SRAM. Generating 1.5 Gb per second, the 72Mb Double Data Rate 3 (DDR3) SRAM will support the high-density, high-speed memory requirements for next generation servers and workstations.

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